First, it should chemically clean your metal surfaces, help with the flow-ability of your filler materials over the base metals, and provide a protective barrier between the metal and your soldering heat. The flux you choose is a chemical component that is vital to a successful solder. By using flux, however, on the metal surface, you can prevent the growth of additional oxides while applying heat to your solder joint. Oxidation occurs much faster when this type of heat is applied. When you solder, you apply high heat to the area. We live in a world supported by oxygen, so you will never be able to have a metal surface completely devoid of all oxides. When you metals are coated in oxides, soldering can become difficult, if not impossible. Tin, aluminum, copper and almost all other metal surfaces are susceptible to oxidation. Rust on iron, for example, is a visible iron oxide created by this process. This reaction creates metal oxides on the surface of your material and can impact conductivity, current flow, and your solder. When a metal surface comes into contact with oxygen, it creates a chemical reaction. While cleaning metal surfaces can easily remove the dust and grime, oxides are a different story. Secondly, the metal surfaces that are to be jointed should be free of oxides, dust, and other such particles that can damage the integrity of the solder joint. The first is a solder that is compatible, in a metallurgical sense, with the types of metals you are bonding. For a solid bond, there are two main things you need. In other words, the solder chemically reacts with other metal surfaces to create a joint. When solder is melted down to form a joint between two opposing metal surfaces, it crease what is referred to as a metallurgical bond. To help increase the likelihood of a good solder, professionals recommend the use of a flux. However, improper soldering can lead to bad joints or even no joints at all. If you work with electronics, you know that soldering is an essential part of your job.
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